Micron-level soldering expert: Carbide laser solder ball nozzle
Introduction:
200-1500μm full range coverage —zero hole blocking·coaxiality ±0.002
It breaks through the bottlenecks of hole blocking and solder sticking of traditional nozzles, and realizes tens of millions of burr-free and splash-free precise solder ball injection in the field of microelectronics packaging.
Specification:
| Solder ball size (μm) | Inner diameter (mm) | Tolerance standard | Applicable scenarios |
| 200-250 | Φ0.09-0.12 | ±0.001mm | IC wafer/acoustic device micro solder joint |
| 300-350 | Φ0.34±0.003 | ±0.003mm | Mobile phone camera/data cable solder joint |
| 450-600 | Φ0.55-0.65 | ±0.004mm | Automotive radar/FPC soft board |
| 750-900 | Φ0.85-0.95 | ±0.005mm | Power module/relay (main model) |
| 1000-1500 | Φ1.02-1.50 | ±0.008mm | High power PCB ground pad |
PS. : The size is for reference only, customization is supported
Application:
Consumer electronics
Mobile phone camera module: 0.15mm solder joint spacing CCM welding (350μm solder ball nozzle)
Type-C interface terminal: multi-level countersunk hole precision welding (aperture tolerance ±0.003mm)
TFT/FPC flexible screen: non-contact welding in temperature sensitive areas (avoid electrostatic damage)
High-end electronics and semiconductors
Reversing radar sensor: anti-vibration welding (600μm nozzle for 1.0mm pad)
IC wafer packaging: φ0.09μm micro-hole solder ball precise positioning (coaxiality ≤0.005)
Optical module fiber coupling: spatter-free welding (inert gas protection process)
Industrial core components
Automobile key chip: micro solder joint oxidation resistance (400μm nozzle)
Fuse ceramic tube: stable spraying in high temperature environment (temperature resistance >850℃)
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Micron-level Soldering Laser Solder Ball Tungsten Carbide Blasting Nozzle Images
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